Description |
Capability |
|
No. of layer |
Single, Double-sided, 4 layer, 6 layer |
Base material |
HB, CEM-1, CEM-3, FR-1, FR-2, FR-4 |
Board thickness |
0.15 - 2.4mm |
| Min. drill size |
0.3mm |
|
Min. Line Width\Spacing |
4 mil / 4 mil |
Min. Pad Size |
0.6mm |
Finished copper thickness |
1/2 oz - 4 oz |
Type of Surface finish |
HASL, Gold Plate (Hard / Soft), Gold Finger, Immersion-gold plate, Ni Plate, Cu Plate, Entek |
Type of Solder Mask |
Dry film, Wet film, Thermal Cure |
Option |
Carbon Paste, Blue Peel Mask, Chamfer |
Profile |
N.C. Routing, Punching, CNC V-Cut, Milling, Beveling |
| |
|