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| Production Capability |
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| Layers |
Single, double-sided, 4 layer, 6 layer |
| Base material |
HB, CEM-1, CEM-3, FR-1, FR-2, FR-4
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| Board thickness |
0.15 - 2.4mm |
| Min. drill size |
0.3mm |
| Min. line width \ spacing. |
4 mil / 4 mil |
| Min. pad size |
0.6mm |
| Finished copper thickness |
1/2 oz - 4 oz |
| Type of surface finish |
HAL,HASL, Gold Plate (Hard / Soft),
Gold Finger, Immersion-gold plate, Ni Plate, Cu Plate, Entek |
| Type of solder mask |
Dry film, Wet film, Thermal Cure |
| Option |
Carbon Paste, Blue Peel Mask, Chamfer |
| Profile |
N.C. Routing, Punching, CNC V-Cut, Milling,
Beveling |
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