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Production Capability Layers Single, double-sided, 4 layer, 6 layer Base material HB, CEM-1, CEM-3, FR-1, FR-2, FR-4                 Board thickness 0.15 - 2.4mm Min. drill size 0.3mm Min. line width \ spacing. 4 mil / 4 mil Min. pad size 0.6mm Finished copper thickness 1/2 oz - 4 oz Type of surface finish HAL,HASL, Gold Plate (Hard / Soft), Gold Finger, Immersion-gold plate, Ni Plate, Cu Plate, Entek Type of solder mask Dry film, Wet film, Thermal Cure Option Carbon Paste, Blue Peel Mask, Chamfer Profile N.C. Routing, Punching, CNC V-Cut, Milling, Beveling     Equipment Quantity Board-Scrubbing Machine 5 Black oxide line 1 PC Trimmer 1 CNC drilling & routing M/C 2 CNC drilling 8 PTH line 1 D/F laminator 2 D/F exposer 3 3 Auto Pattern plating line 2 Auto Pattern plating line (Tin/Lead) 2 W/F exposer 1 Conveyor oven 3 Silkscreen (Automatic) 6 Horizontal Hot Air Leveler 3 V-slot cutter 1 E-tester 18 Vacuum packing M/C 2 CAM station 10 Waste treatment system 1

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