The customer's parts lists are thoroughly checked to the printed circuit boards.

Part numbers and approved vendors are assigned and entered onto our manufacturing requirement system (Misys MRP System by Accpac).

A bill of materials is then generated.

A manufacturing order (requirements report) is printed.

Parts required from the manufacturing order are then ordered from our in house stock or from qualified vendors .

On arrival the parts are inspected for authenticity against customer specifications and internal part numbers are allocated to each part.

The parts are stored in customer-designated areas.

The parts are received onto the MRP system and checked against a standard price.

The manufacturing order is reprinted to confirm that there are no shortages.

If there are no shortages, the job is issued to the production floor. 

Screen Printing:

The automated screen-printing machine is set up using the customer's dedicated solder stencil.

No-clean solder paste is used. This no-clean process improves quality, as boards do not require additional handling and washing.

One sample board is pasted, solder levels are checked and relevant component footprints checked that they are precisely printed.

Placing of the surface mounted parts:

The surface mount parts are loaded onto the Samsung Surface Mount Component Placing machines and are then verified by a supervisor. These machines have high-speed capabilities (25000 components per hour), extreme accuracy (fine pitch down to 0201) with built in laser and vision positioning systems.

A first-off sample board is then built on the pick and place machine

The sample board is checked and verified to the customer's specifications.

This board is then re-flow soldered using an Electrovert Omniflo controlled atmosphere forced convection seven zone oven.

Another supervisor checks the solder quality using a specialized microscope.

Once the first off sample is approved, the surface-mount production starts.

Boards coming off the line are fully inspected on a separate inspection line.

Placing of the through hole parts:

Boards that require through-hole parts are placed on the through-hole conveyer assembly line.

One assembler is assigned one part at a time to place throughout the assembly line.

A second assembler places the next single part onto all of the boards.

This ensures accuracy, speed, and quality of insertion.

Once all through-hole parts are inserted, a supervisor will then verify that all the parts are correctly placed, by checking one part at a time through the whole line.

Wave Soldering of the through hole parts:

A Technical Devices wave soldering machine is used to solder the through hole components.

This machine has precise spray fluxing capabilities using no-clean flux, eliminating board cleaning and corrosion.

The machine has ample pre-heating allowing boards to be soldered continuously and consistently whilst maintaining a constant pre-heat temperature.

Two waves, a smart wave and an omega wave ensure clean solder joints with the highest quality.

Inspection of through-hole soldering:

Boards are inspected using specialized magnified lamps and microscopes.

Joints are checked for low solder, blow holes and flow through to the top of the board.

Final inspection surface mount and through-hole placements:

Final complete board inspection is performed using an automated yield enhancement machine. This is thin camera advanced technology, inspects boards for solder defects, lead defects, part presence and position, correct part and polarity.   

Final stage hard wiring and hand soldering of peripherals:

Boards are then hard wired where required and all other peripherals parts are hand soldered

Testing:

Depending on customer requirements, different testing procedures are performed. These include electrical testing, power testing calibration and full functional testing.

Specialized scopes, generators, optical equipment and test jigs are used.

Anti-static protection:

The production area is fitted with static-protective flooring from 3M Electronic Protective Division - Floor type 3M 8400 Series ESD Tile. Conductivity range: (2.5X10, 000 to 1X10, 000,000)

All operators, assemblers, supervisors and managers are fitted with anti-static arm and foot straps at all times.

Sales Engineer:

One of the owners of the company is actively involved in product costing, customer liaison and generating quotations. He is also involved in production planning, purchasing and incoming goods inspection with 11 years of electronic production experience

Process Engineer:

Our Engineer is actively involved in preparation of jobs for the factory floor. He is a vital link between the customer and the factory, ensuring accurate CAD data for the screen-printing machine, pick and place machine and that the correct bills of materials are available for production planning. Marc has been in the electronics industry for the past 25 years.

Production Engineer:

The owner of the company, is actively involved on the production floor, scheduling jobs, monitoring production, quality control, testing and shipping. He has been actively involved in electronic production for the last 27 years.